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Technical Capacity:
Min. Conductor Width/Space: 0.1mm(0.004¡±)
Min. Hole Diameter: 0.25mm(0.010¡±)
Min.SMD Pitch: 0.5mm(0.020¡±)
Max.Panel Size: 610mm X 914mm (24¡±X36¡±)
Board Thickness: 0.5mm-4mm(0.02¡±-0.16¡±)
Board Finished: SMOBC
Inner Layer
Product Layer:3-18
Board thickness:0.02"-0.16"(0.5mm-4mm)
Layer to layer registration:5mil(0.127mm)
Wet Process
Tin/lead thickness by HAL:0.00008"-0.0001"(0.002mm-0.025mm)
Copper Plating Size: 24"X36"(610mmX914mm)
Aspect ratio:8:1
Au thickness on gold fingers by electric plating:0.000012"-0.000060"(0.0003mm-0.0015mm)
Au thickness on board surface by way of immersion:0.000005"-0.000008"(0.00013mm-0.00020mm)
The min.line width/spacing:0.004"/0.004"(0.1mm/0.1mm)
Min.SMD pitch:0.020"(0.51mm)
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