| Item |
Mass production capability |
Prototype prodution capability |
Design capability |
| Smallest Trace Width/Space |
75/75um |
50/75um |
40/40um |
| inner layer copper thickness |
1/3OZ－3OZ |
≥1/7OZ ≤6OZ |
|
| inner layer core thickness |
≥0.050mm |
≥0.04mm |
0.04mm |
| Min. hole |
Mechanical |
0.2mm |
0.1mm |
0.1mm |
| Laser |
0.1mm |
0.075mm |
0.03mm |
| Min.space from hole to line |
PTH |
0.18mm |
0.15mm |
0.125mm |
| NPTH |
0.15mm |
0.125mm |
0.1mm |
| Max PCB Finish Boardsize |
533*610mm |
610*762mm |
610*910mm |
| Layer Capability |
26L |
30L |
40L |
| Board Thickness |
0.4－3.2mm |
≥0.25mm ≤5.0mm |
7.0mm |
| Board Thickness tolerance |
±10％ |
±7％ |
|
| HDI（Build up） |
1+N+1
2+N+2 Min L/S≥75/75um |
2+N+2 Min L/S<75/75um
(IVH Aspect ≤8:1) |
HDI board |
| Aspect Ratio |
PTH |
15（￠0.2mm/3.0t） |
17 |
20 |
| LVH |
0.8 |
1 |
1.5 |
| Finish hole tolerance |
PTH |
±0.08mm |
±0.05mm |
|
| NPTH |
±0.05mm |
±0.025mm |
|
| Material |
FR-4(High TG、Halogen Free、High-frequency)
RCC
FR-408、NELCO |
Ceramic Material |
BT、Polyamide、Teflon、Aluminium base material |
| Impedance Control |
±10% |
±7% |
±5% |
| Surface treatment |
OSP、HASL（Sn/Pb）、
Immersion Tin(Sn)、
Immersion Gold(Ni/Au)、
OSP+Immersion Gold(Ni/Au)、
Gold Finger+Immersion Gold(Ni/Au) |
Immersion Silver(Ag)
HASL(Lead free) |
|
| Copper plation thickness |
≥20um |
≥35um |
|
| Mmersion Gold Thickness |
Gold thickness |
0.03-0.076um |
0.03-0.1um |
|
| Nickel thickness |
2.5-5um |
2.5-8um |
|
| Gold Finger |
Gold thickness |
0.76-1.5um |
1-3um |
|
| Nickel thickness |
2.5-5um |
2.5-8um |
|
| HAL lead free thickness |
0.5-50um（SMD pitch<1/5） |
|
| Immersion Tin thickness |
0.8-1.2um |
1.0-1.2um |
|
| Solder Mask |
Method:E-spray/Screen paint
Color:Green/Red/Black/Blue
|
|
| V-cut Angle |
30°、45°、60° |
|
| V-cut Deepth Tolerance |
±0.15mm |
±0.1mm |
|
| SMD Pitch |
1/5 |
1/6 |
|
| BGA Space |
0.5mm |
0.4mm |
|
| Outline Tolerance |
±0.1mm |
±0.050mm |
|
| Special Technics |
Edge plating,Counter
sink,Carbon Ink,Insulating solder mask,
Peelable resist |
|